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LAMINATED CONSTRUCTIONS

LAMINATED CONSTRUCTIONS
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Item Name Data Sheet Part # Total Thickness Description Applications Compare
MF-100 PN1 .0009" .0005" Polyester Film laminated to .00035" Aluminum Foil Engineered as a cableshield film for use in the wire and cable industry
C-25 NPS PN449 .0025" .00092" Polyester Film laminated to .0014" Copper Foil EMI and RFI shielding of electronic components
MF-150 PN6 .0015" .00092" Polyester Film laminated to .00035" Aluminum Foil Engineered as a cableshield film for use in the wire and cable industry
PFP-575 RED PN1124 .0021" .0006" Polypropylene laminated to each side of .0007" Aluminum Foil. Blue in color. Designed for applications that require a foil material to be embedded within polypropylene films
MF-250 PN21 .0025" .00092" Polyester Film laminated to .001" Aluminum Foil Engineered as a cableshield film for use in the wire and cable industry
FMF-121 PN1924 .004' 1 mil foil laminated to both sides of a 2 mil polyester film EMI and RFI shielding of electronic components
MC-180 PN43 N .0007" E.D. copper foil laminated to .00092" polyester film. No adhesive is used on this construction. EMI and RFI shielding of electronic components
A-25 PN414 .0025" .00035" Aluminum foil laminated to .002" Polyester Film EMI and RFI shielding of electronic components
A-35 NPS PN415 .0035" .00035" Aluminum Foil laminated to .003" Polyester Film EMI and RFI shielding of electronic components
A-55 NPS PN416 .005 .00035" aluminum laminated to 5 mil polyester film EMI and RFI shielding of electronic components
A-31 NPS PN426 .0031" 1 mil aluminum foil laminated to 2 mil Polyester film EMI and RFI shielding of electronic components
A-41 NPS PN427 .0041" 1 Mil Aluminum Foil laminated to 3 mil Polyester Film EMI and RFI shielding of electronic components
C-13 NPS PN436 N .007" copper foil laminated to a .005" polyester film. No adhesive is used on this material. EMI and RFI shielding of electronic components
C-18 PN437 N .007" copper foil laminated to a .0092" polyester film. No adhesive is used on this material. EMI and RFI shielding of electronic components

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